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      Learn More

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      Learn More

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      Learn More

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      Among them, the Qualcomm QRB5165 solution is designed to help build consumer, enterprise or industrial robots with 5G connectivity, on-device AI and machine learning, superior computing, and intelligent sensing capabilities. By adopting Qualcomm QRB5165, ADLINK’s module will enable the proliferation of 5G in robotics and intelligent systems.

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COM Express Type 6

Express-CF/CFE

COM Express® Basic Size Type 6 Module with Up to Hexacore 8th Gen Intel Core™ 8000 series and Intel Xeon® Processors
CITATION REQUISE
Principales caractéristiques
  • PICMG COM.0 R3.0 Type 6 module with Hexacore i7/Xeon and Quadcore i3
  • Up to 48GB Dual Channel DDR4 at 2133/2400MHz
  • Three DDI channels, one LVDS (or 4 lanes eDP), supports up to 3 independent displays
  • One PCIe x16 Gen3, eight PCIe x1 Gen3 (NVMe SSD & Intel® Optane™ Memory Technology support)
  • GbE, four SATA 6 Gb/s, four USB 3.1 and four USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
Suite
  • Introduction
  • SEMA
  • Informations de commande
The Express-CF/CFE is the first COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.

Whereas previous generations Intel® Core™ i3 processors supported only dual cores with 3MB cache, the Intel® Core™ i3-8100H is the first in its class to support 4 CPU cores with 6MB of cache. This major upgrade results in a more than 80% performance boost in MIPS (million instructions per second), and an almost doubling of memory/caching bandwidth, all at no significant cost increase compared to earlier generations. Intel® Core™ i3 processors are widely recognized as the best valued processor and are therefore preferred in high-volume, cost-sensitive applications. They are popular choices in gaming, medical and industrial control to name a few.

These Hexa-core processors support up to 12 threads (Intel® Hyper-Threading Technology) as well as an impressive turbo boost of up to 4.4GHz. These combined features make the Express- CF/CFE well suited to customers who need uncompromising system performance and responsiveness in a long product life solution.

The Express-CF/CFE has up to three SODIMM sockets supporting up to 48GB of DDR4 memory (two on top by default, one on bottom by build option) while still fully complying with PICMG COM.0 mechanical specifications. Modules equipped with the Xeon® processor and CM246 Chipset support both ECC and non-ECC SODIMMs.

Integrated Intel® Generation 9 Graphics includes features such as OpenGL 4.5, DirectX 12/11, OpenCL 2.1/2.0/1.2, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full H.265/HEVC 10-bit, MPEG2 hardware codec. In addition, High Dynamic Range is supported for enhanced picture color and quality and digital content protection has been upgraded to HDCP 2.2. Graphics outputs include LVDS and three DDI ports supporting HDMI/DVI/DisplayPort and eDP/VGA as a build option. The Express-CF/CFE is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time. In addition to the onboard integrated graphics, a multiplexed PCIe x16 graphics bus is available for discrete graphics expansion.

Input/output features include eight PCIe Gen3 lanes that can be used for NVMe SSD and Intel® Optane™ memory, allowing applications access to the highest speed storage solutions and include a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer.
At the heart of SEMA is the Board Management Controller (BMC) supporting SEMA functions. The SEMA Extended EAPI provides access to all functions and can be integrated into the user’s own applications. The SEMA GUI and SEMA Command Line Interface allow monitoring, control and use of the SEMA parameters and functions directly on your device for test and demonstration purposes.Optionally SEMA supports also remote procedure calls – please refer to SEMA Software Installation Guide.

Detailed forensic information is available after system or module failures. The BMC Power-Up Error Log function provides detailed information about history of failures that may have occurred during power-up sequences. Log information includes e.g. error number, flags, restart event, power cycles, boot count, status, CPU temperature and board temperature. Moreover minimum and maximum temperature of the CPU and system is available, as well as HDD S.M.A.R.T information- all of which can be used to analyze system or module failure in detail.

SEMA is available for Linux and Windows operating systems and for various HW platforms.
Ordering Information
  • Express-CF-i7-8850H
    Basic COM Express Type6 module with 8th Intel Core i7-8850H processor at 2.6/4.3GHz with QM370 chipset
  • Express-CF-i5-8400H
    Basic COM Express Type6 module with 8th Intel Core i5-8400H processor at 2.5/4.2GHz with QM370 chipset
  • Express-CF-i3-8100H
    Basic COM Express Type6 module with 8th Intel Core i3-8100H processor at 2.6GHz with HM370 chipset
  • Express-CFE-E-2176M
    Basic COM Express Type6 module with 8th Intel Xeon E-2176M processor at 2.7/4.4GHz with CM246 chipset
Accessory
  • HTS-CF-B
    Heatspreader for Express-CF/CFE with threaded standoffs for bottom mounting
  • HTS-CF-BT
    Heatspreader for Express-CF/CFE with through hole standoffs for top mounting
  • THS-CF-BL
    Low profile heatsink for Express-CF/CFE with threaded standoffs for bottom mounting
  • THS-CF-BT
    Low profile heatsink for Express-CF/CFE with through hole standoffs for top mounting
  • THSH-CF-BL
    High profile heatsink for Express-CF/CFE with threaded standoffs for bottom mounting
  • THSF-CF-BL
    High profile heatsink with Fan for Express-CF/CFE with threaded standoffs for bottom mounting
Starter Kit
  • Starter kit for COM Express Type 6
    [Click] COM Express Type 6 Starter Kit Plus

Produits connexes

  • Express-BASE6
    COM Express® Type 6 Reference Carrier Board in ATX Form Factor
  • COM Express Type 6 Starter Kit Plus
    COM Express Type 6 Development Kit

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