Centralized Motion Controller | Motion Control | ADLINK

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High Performance, Precision Positioning and Excellent Synchronization

ADLINK‘s pulse train controllers provide comprehensive and application-oriented motion functions for servo and stepper motors through digital signal processing (DSP)-based and Application Specific Integrated Circuit (ASIC)-based two pulse train mode controllers to achieve excellent synchronous motion control and precise positioning suitable for laser engraving, marking and cutting applications in semiconductor, AOI, and conventional manufacturing industries.

ADLINK offers a range of single pulse train controllers supporting 2, 4, and 8-axes motion control through PCIe/PCI/cPCI interfaces. With the new AMP series supporting eight-axes motion control, customers have even more options for choosing the controller that best suits their needs. Combined with a selection of special terminal boards and connecting cables, line distribution is simplified, improving efficiency and reducing overall cost. Additionally, ADLINK’s automation product software (APS SDK) enhances development with a user-friendly interface offering no-code development, easy upgrades, centralized management, and rapid deployment of motion control systems.

Product Selections

2-Axis
4-Axis
8-Axis
Terminal Boards

Application Story

Die Sorting
Probe Testing
Laser Dicing
Die Bonding

ADLINK Introduces a High-Efficiency Die Sorting Solution to Overcome Packaging and Testing Bottlenecks

To perform the quality inspections of dies, manufacturers are always looking for ways to significantly increase sorting efficiency, so that good dies can be more quickly sorted from faulty ones. As semiconductor manufacturing continues to evolve, die sizes have become increasingly smaller while the number of units that need to be tested has conversely grown exponentially. ADLINK's sorting solution integrates both image acquisition cards and motion control cards, allowing end users to easily achieve rapid feedback response, striking the optimal balance between speed and accuracy.

ADLINK’s Probe Test Solution Greatly Improves the Speed and Accuracy of IC Electrical Measurement

The process of probe testing comprises a series of up and down movements of the probe head as it comes into contact with the silicon wafer. Good probe testing is predicated on good motion control. ADLINK integrates an analog input function into the motion control card, effectively preventing the probe from moving abnormally.

A silicon wafer might have thousands of points to be tested. ADLINK's probe testing solution enables the probe to moving quickly and with stability, while reducing the total amount of time needed for the testing process.

Technological Break-through for Semiconductor Laser Dicing

Contemporary chip designs tend to be lighter, thinner, and have three-dimensional heterogeneous integration, with cuts that are becoming more complex. A few of the current challenges for laser dicing include: poor accuracy, difficult to achieve high-precision motion trajectory, hard to adjust laser power, time-consuming speed planning, inability to provide real-time trigger control feedback, images analysis, and motion control that cannot be fully integrated.

ADLINK's laser dicing solution integrating visual alignment and motion control achieves quick positioning while matching sensors; it can also control laser intensity, easily switch and adjust laser power, and help avoid the laser dicing system operating repeatedly in the same path.

With Its Powerful Die Bond Solution, ADLINK Helps Semiconductor Factories Accelerate Their Back-end Packaging Process

As the semiconductor miniaturization process continues to evolve and advance, ensuring that pick-and-place motions operate faster, while achieving more accurate positioning is extremely important. ADLINK has long been a trusted provider of die bond solutions, and is well versed in the operational requirements of its customers. As such, we are able evaluate the factors that may affect die bond operations for each semiconductor process conversion, and then use the most suitable technologies to eliminate any issues.

车用解决方案

国防与军工

智能医疗

工业自动化

网络和通信

智能物流

半导体解决方案

智慧城市

测试测量

铁路

机器人技术

特色解决方案

5G MEC

自动驾驶

GPU解决方案

ROS2解决方案

智能制造

支持

下载专区

联系我们

价值

公司

新闻

车用解决方案

国防与军工

智能医疗

工业自动化

网络和通信

智能物流

半导体解决方案

智慧城市

测试测量

铁路

机器人技术

特色解决方案

5G MEC

自动驾驶

GPU解决方案

ROS2解决方案

智能制造

支持

下载专区

联系我们

价值

公司

新闻

Key Success Factors Specific to the Semiconductor Industry

One Library, One UI and No-code Testing

High Performance, Precision Positioning and Excellent Synchronization

Product Selections

PCI-8102

PCIe-8154

AMP-204C/AMP-208C

PCI-8254/8258

PCI-8134A

PCI-8164

AMP-304C

AMP-104C

PCIe-8158

AMP-204C/AMP-208C

PCI-8254/8258

DIN-825-4P0

DIN-814-GP

DIN-814Y0

DIN-814P-A40

DIN-812M0

DIN-814M-J3A0

DIN-814M0

DIN-814PA

Application Story

ADLINK Introduces a High-Efficiency Die Sorting Solution to Overcome Packaging and Testing Bottlenecks

ADLINK’s Probe Test Solution Greatly Improves the Speed and Accuracy of IC Electrical Measurement

Technological Break-through for Semiconductor Laser Dicing

With Its Powerful Die Bond Solution, ADLINK Helps Semiconductor Factories Accelerate Their Back-end Packaging Process

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