The ADLINK I-Pi OSM IMX95 Development Kit provides an industrial-grade, application-ready platform designed to jumpstart the prototyping and software validation of next-generation edge AI and IoT applications. Built around the powerful NXP i.MX 95 applications processor, this kit pairs a feature-rich 4” reference carrier board with ADLINK's 45x45mm high-efficiency OSM-IMX95 Computer-on-Module. By integrating edge AI, robust graphics processing into a cohesive evaluation system, the I-Pi OSM IMX95 allows developers to instantly build and benchmark complex vision analytics, smart automation routines, and deterministic robotic control loops with an out-of-the-box hardware experience.
The core advantage of this development platform lies in the pioneering Open Standard Module (OSM) modular design. As a solder-down, Size-L BGA form factor, the OSM module completely eliminates the mechanical vulnerabilities, extra weight, and added cost associated with traditional board-to-board connectors. This architecture provides the perfect middle ground for system design: engineers gain the fast time-to-market and low design complexity of a modular building block, combined with the extreme vibration resistance, absolute shock protection, and slim profile of a fully custom discrete design. By validating your software on the I-Pi platform, you can seamlessly scale your hardware footprint from early proof-of-concept directly into a hardened, high-volume production environment without rebuilding your application stack from scratch.
Specifications:
· ADLINK OSM-EB4 4” carrier with soldered down OSM-IMX95 module based on NXP i.MX 95 applications processor
· SGeT OSM R1.2 compliant, Size-L computer on module (45mm x 45mm)
· Up to 2 TOPS NXP eIQ Neutron NPU and Arm Mali-G310 GPU
· 4GB LPDDR4X memory and 32GB eMMC storage
· HDMI, Dual channel LVDS, MIPI-DSI, MIPI-CSI 4 lanes, Dual GbE LAN support
· Industrial temperature: -40°C to +85°C (optional)
· 15 years product availability