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Built for environments that
destroy ordinary computersWhen your platform faces -40°C to 70°C swings, 50G shocks, and corrosive contaminants,
ADLINK's 30-year embedded expertise keeps field-deployed systems running. -
EN 50155 certified AI platforms
for rail operatorsFrom 5G train-to-ground gateways to onboard edge AI servers —
built to survive rail shock, wide temperature, and 10+ year product lifetimes. -
Open architecture AI processing
for extreme conditionsProvides SOSA-aligned VPX GPU and CPU blades
that are pre-validated, conduction-cooled, and extreme rugged designed.
- 30+
- Years Embedded
Expertise
- 20+
- Support
Offices
- 10+
- Years Product
Lifecycle
Compliant With
EN 50155- EN 45545-2
- IEC 62443-4-1
- ITAR Registered
What your platform faces in the field
Extreme rugged applications impose three categories of stress that commercial-grade systems cannot survive.
Wide Temperature
PCB and system must survive extreme thermal cycling depot cold starts through full operational heat load without fan-based active cooling.
-40 to 70°C operational rangeShock & Vibration
Rail joints, vehicle dynamics, and constant multi-axis vibration fatigue solder joints and loosen connections over time on unprotected boards.
50G shock/ 6 axis continuous vibrationContaminants
Salt spray, fungal growth, high humidity, and dust accelerate corrosion and cause insulation breakdown on unprotected electronics.
Salt/ fungus/ humidity/ dustVALUE PROPOSITION
Four commitments that protect your platform
Every ADLINK extreme rugged design maps directly to a field challenge - engineering in, not added on.
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Extreme Rugged Resilience
- -40°C to 70°C operation with high-Tg PCB and FloTHERM validated thermal design
- Solder-down design component design eliminates connector failure under vibration
- Conformal coating with UV tracer for salt, moisture, and fungus protection
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SWaP-Optimized
Open Architecture- Provide open standards like VNX+ (VITA 90), OSM, and SMARC for minimal size and weight.
- Ultra-low-power Arm-based and x86 solutions.
- SOSA-aligned platforms for critical open systems programs
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Long-term Product Support
- 10+ year product longevity – aligned to railway and aerospace project lifetimes
- Backed by Tier-1 silicon partners to ensure sustained lifecycle management and updates.
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Edge AI Ready
- Standard MXM 3.1 Type A/B for field upgradeable GPU acceleration
- Pre-validated AI platforms through elite partnerships with NVIDIA, Intel
- Support real-time object detection, radar processing, and sensor fusion at the edge
Choose Your Rugged Modules & Platforms
- VITA Compliant Rugged Platform
- CompactPCI & Serial
- PC104
- Computer-on-Module
- Railway AI Platform
- Edge AI Platform
- Rugged Storage
COM HPC VPX3-TL SOSA-aligned, Rugged 3U VPX Processor Blade with Intel®® Xeon® W-11865MRE Learn More 
COM HPC 3U VPX Development Kit Intel Atom® Processor E3900 Family-Based Ultra Compact Embedded Platform Learn More 
COM HPC VPX3-XMXM 3U VPX GPGPU Blade with NVIDIA RTX™ 5000 or 2000 Ada Learn More 
COM HPC VPX3-MXM/A4500 AI-enabled Rugged SOSA-aligned 3U VPX NVIDIA GPGPU Blade Learn More 
COM HPC VNX-PTL SOSA-aligned VNX+ CPU Blade powered by Intel® Core™ Ultra Processor Series 3 Learn More
COM HPCcPCI-A3535 Series 3U CompactPCI Serial Intel® Xeon® W Processor Blade Learn More 
COM HPCcPCI-A3MXM 3U CompactPCI Serial MXM GPU Carrier Card Learn More 
COM HPC AD-3100 3U Compact PCI Serial Extreme Rugged Multifunctional Workstation Learn More 
COM HPC cPCI-3520 Series 3U CompactPCI Intel® Xeon® E/ 9th Gen Intel® Core™ Processor Blade Learn More 
3U CompactPCI Blades cPCI-3640 Series 3U CompactPCI Quad-Core Intel Atom® Processor X Series Blade Learn More 
COM HPC cPCIS-1202 3U Enclosure with 32-bit Backplane, CompactPCI Redundant Power Supply Learn More
COM HPC CM1-BT1 Extreme Rugged PCI-104 Single Board Computer with Intel® Atom™ Processor E3800 Series SOC Learn More 
COM HPC CM2-BT2 Extreme Rugged PC/104-Plus Single Board Computer with Intel® Atom™ Processor System-on-Chip Learn More 
COM HPC CM3-BT4 Extreme Rugged PC/104-Plus, PCI-104 Single Board Computer with Intel® Atom™ Processor System-on-Chip Learn More
COM HPC DLAP-211-Orin Series Deep Learning Acceleration Platform Powered by NVIDIA® Jetson Orin™ NX or Nano Module Learn More 
COM HPC DLAP-411-Orin Supreme Compact Edge AI Platform for Industrial GenAI Applications Learn More 
COM HPC DLAP-711 Series Compact Edge AI Platform Powered by NVIDIA® Jetson Thor™ Learn More
Deployed Across Key Industries
Custom Rugged ODM Solutions by ADLINK
What does ADLINK do?
ADLINK’s Rugged ODM service provides in-house designed CPU and GPU modules, seamless carrier board integration, and strict compliance with extreme rugged standards like MIL-STD-810G.
We specialize in delivering end-to-end custom engineering for extreme rugged edge computing. Rather than simply supplying components, ADLINK acts as your complete design and manufacturing partner, transforming complex hardware requirements into fully certified, deployment-ready systems.
Inhouse Designed CPU / GPU
- ADLINK rich CPU modules portfolio: COM Express/ COM-HPC/ OSM/ SMARC
- ADLINK embedded MXM GPU offering
Carrier Board Integration
- Seamless integration with carrier board
- Mil-Grade Power Su
Rugged Certifications & Compliances
- Railway Certified: EN50155, EN45545
- Rugged: MIL-STD-810G
- Cyber Security: IEC 62443-4-1
Our 4-Step ODM Process
Custom Rugged ODM Solutions by ADLINK
A:Our systems are engineered from the board level up to withstand harsh environments. We design and validate in-house to ensure our hardware meets rigorous shock, vibration, and wide operating temperature standards without compromising computing performance.
A:Yes, our ODM services cover everything from modifying standard commercial off-the-shelf (COTS) products to engineering fully custom system designs tailored specifically for rolling stock and wayside deployments.
A:We understand that industrial deployments require longevity. We offer extended lifecycle management and revision control, typically supporting products for 8 to 10 years to ensure long-term stability.
A:Running AI inference at the edge requires high-powered GPUs that generate significant heat. We engineer our custom systems using advanced thermal management techniques—such as conduction cooling, specialized heat spreaders, and completely fanless enclosures. This ensures reliable, unthrottled AI performance even when operating in wide temperature ranges (-40°C to +85°C) and extreme rugged conditions.
