Summary:
- Comprehensive Intel® Core™ 200S Series Processors Adoption: ADLINK integrates Intel® Core™ 200S series processors across Mini-ITX, ATX, PICMG 1.3, COM-HPC, and edge AI platforms.
- Optimized for Edge AI & Industrial Applications: Designed for gaming, industrial automation, robotics, transportation, medical imaging, and various AI workloads at the edge.
- High-Performance, AI-Ready Platforms: Featuring PCIe Gen5, DDR5, integrated Intel® UHD Graphics, and ruggedization for harsh environments.
ADLINK Technology Inc., a global leader in edge computing, proudly announces the launch of a comprehensive portfolio of industrial computing solutions built on Intel® Core™ 200S series processors. These new platforms deliver major gains in AI performance, energy efficiency, and I/O flexibility—empowering next-generation applications in industrial automation, infotainment, edge AI systems, and immersive computing.
The new upgrade spans form factors Mini-ITX, ATX, PICMG 1.3 boards, edge AI systems, and COM-HPC modules, engineered to leverage the hybrid-core architecture and AI-enhanced compute of the Intel® Core™ 200S series processors.
Available Now
| Model |
Description |
Application Examples |
| AmITX-RL-I |
Mini-ITX Embedded Board |
Tailored for self-service kiosks and automated devices. |
| IMB-M47 |
Pro Series ATX Motherboard |
Suited for industrial automation, machine vision, AI inspection, data processing systems, and logistics. |
| IMB-M47H |
| IMB-C47 |
Value Series Industrial ATX Motherboard |
Scalable deployment for entry-level industrial control and manufacturing automation. |
| IMB-C47H |
Available by the end of September
| Model |
Description |
Application Examples |
| DLAP-4100 |
Expandable Mini-ITX Edge AI Platform |
Real-time inference analytics in smart factory, retail, transportation, and safety-critical deployments. |
Available in 2025 Q4
| Model |
Description |
Application Examples |
| NuPRO-E47 |
PICMG 1.3 Full-Size SBC |
Ideal for equipment retrofits in industrial automation. |
| COM-HPC-cBLS |
COM-HPC Client Type Size C Module |
Compute engine for industrial automation, test & measurement, AMR (Autonomous mobile robot), medical imaging, video broadcasting, etc. |
| MVP-3100 |
High-Performance Integrated Embedded Computer |
Engineered for smart manufacturing, semiconductor, smart retail, and logistics. |
| MVP-5200 |
| DLAP-5200 |
High-Performance Edge AI Platform |
High-performance Edge AI platform for advanced vision analytics, robotics, and industrial automation in demanding environments. |
| DLAP-8100 |
Expandable Edge AI Platform |
Suitable for a wide range of applications in retail, parking, agriculture, and manufacturing. |
| AmITX-AD-G |
Mini-ITX Embedded Board |
Gaming machines and interactive digital kiosks. |
With integrated Intel® UHD Graphics, DDR5 support, and PCIe Gen5 readiness across the new platforms, ADLINK’s Intel® Core™ 200S Series Processors-powered solutions are designed to meet the compute, connectivity, and longevity demands of edge AI and industrial applications.
By combining Intel’s newest hybrid-core architecture with our rugged, industrial-grade designs, ADLINK is giving customers a launchpad to deploy smarter and more responsive systems at the edge. From immersive gaming terminals to automation and real-time machine vision, these platforms help our customers push the boundaries of performance and reliability.
For more product information, please visit the ADLINK website.
*Specifications and features mentioned in this release represent the range supported across the product series. Actual support may vary by model. Please refer to the official product page for detailed information.